Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2016200384
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To downsize the whole device, and reduce power consumption.SOLUTION: A heat treatment device for performing heat treatment to an object installed inside a device body 10, includes: a coil 40 that heats a heating element 20, mounted with the object in such a manner that the heat element is disposed so as to cover the periphery of the object, with induction heating thereby to indirectly heat the object; cooling means of supplying inactive gas to a space to cool the object; and a reflection member that is disposed over the object in the space, and in which at least one slit 71 extending from a central part 70a toward a peripheral edge part 70b is formed.SELECTED DRAWING: Figure 1
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Inventors:
TAKEUCHI MASAKI
YOSHIDA TAKASHI
YOSHIDA TAKASHI
Application Number:
JP2015233051A
Publication Date:
December 01, 2016
Filing Date:
November 30, 2015
Export Citation:
Assignee:
FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD
International Classes:
F27B5/04; B23K1/002; B23K1/008; B23K31/02; F27B5/14; F27D11/06
Domestic Patent References:
| JP2007158123A | 2007-06-21 | |||
| JP2012521531A | 2012-09-13 | |||
| JP2013201292A | 2013-10-03 | |||
| JP2003142241A | 2003-05-16 | |||
| JP2007262434A | 2007-10-11 | |||
| JP2003234169A | 2003-08-22 | |||
| JP2000012548A | 2000-01-14 | |||
| JP2001308084A | 2001-11-02 | |||
| JPH10206035A | 1998-08-07 |
Foreign References:
| US20070125770A1 | 2007-06-07 |
Attorney, Agent or Firm:
Sakai International Patent Office