Title:
熱処理炉
Document Type and Number:
Japanese Patent JP5195419
Kind Code:
B2
Abstract:
A heat treating furnace capable of continuously performing binder removal and subsequent firing without requiring a complicated configuration and increasing the equipment size and cost, for example, for degreasing a ceramic molding which is to be fired in a process for manufacturing a ceramic electronic component. A heat insulator is disposed to surround a heat treatment region in a case, and a reflector is disposed between the inner wall of the case and the insulator in order to reflect heat transferred from the heat treatment region through the heat insulator. A module heater including a heater embedded in the insulator is used. As the reflector, there is used a reflector having a structure in which a plurality of thin plates is arranged so that the main surfaces are arranged in parallel to each other with a predetermined space between the adjacent main surfaces.
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Inventors:
Takashi Ohara
Application Number:
JP2008506283A
Publication Date:
May 08, 2013
Filing Date:
March 16, 2007
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
F27B17/00; F27B5/06; F27B5/08; F27B5/14; F27D1/00; F27D11/02; F27D17/00
Domestic Patent References:
| JPS62167096U | 1987-10-23 | |||
| JPH10318681A | 1998-12-04 |
Attorney, Agent or Firm:
Hitoshi Nishizawa