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Patent Searching and Data


Title:
HEATER SUPPORTING DEVICE
Document Type and Number:
Japanese Patent JP2011258544
Kind Code:
A
Abstract:

To provide a heater supporting device for a semiconductor manufacturing apparatus which can prevent damage of a retaining piece, detachment from a piece holder, and poor heat insulation near the ceiling area, thereby obtaining uniform temperature characteristics and increasing the service life.

A heating element 31 formed in a coil shape is arranged around a heated body. A large number of retaining pieces 32 are sequentially disposed in a vertical direction. Long elongated cavities 38 are formed in a radial direction between the retaining pieces. The heating element is inserted through the cavities and supported via the retaining pieces. A fitting recess is formed on one of the upper face and the lower face of the retaining piece in a direction intersecting the heating element, and a fitting projection which can be fitted with the fitting recess is formed on the other face. The retaining pieces are sequentially disposed via the fitting of the fitting recess and the fitting projection.


Inventors:
KOSUGI TETSUYA
MURATA HITOSHI
SUGIURA SHINOBU
UENO MASAAKI
Application Number:
JP2011000058673
Publication Date:
December 22, 2011
Filing Date:
March 17, 2011
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H05B3/06; F27D11/02; H05B3/62
Domestic Patent References:
JP2009180462A2009-08-13
JPH1167424A1999-03-09
JPS6183030U1986-06-02
JP4145328B22008-09-03
Attorney, Agent or Firm:
三好 祥二