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Patent Searching and Data


Title:
HEATING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014158023
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress shearing of a holder due to thermal deformation of a heat generating body while suppressing a shift of the heat generating body.SOLUTION: A heating device comprises: a heat generating body which is formed zigzag through connection of a plurality of mountain parts and valley parts alternately and has both fixed ends; holder reception parts provided at ends of the valley parts respectively and formed as cut parts having wider width than that of the valley parts; a heat insulator provided at an outer circumference of the heat generating body; and holders arranged in the holder reception parts and fixed to the heat insulator.

Inventors:
MURATA HITOSHI
KOSUGI TETSUYA
SUGIURA SHINOBU
Application Number:
JP2014020250A
Publication Date:
August 28, 2014
Filing Date:
February 05, 2014
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/324; C23C16/46; F27B5/14; F27D11/02; H01L21/205; H01L21/22; H05B3/06
Domestic Patent References:
JP2002329675A2002-11-15
JP2011023685A2011-02-03
JP2012009702A2012-01-12
JP2008263170A2008-10-30
JP2007088325A2007-04-05
JPH0331296U1991-03-27
JP2008243820A2008-10-09
Foreign References:
US5536919A1996-07-16