PURPOSE: To provide a heating device used in the heating of the end part to be subjected to secondary processing of a synthetic resin pipe when secondary processing for forming a receiving mouth or the like is applied to the end part of the synthetic resin pipe and generating no molding deficiencies.
CONSTITUTION: A heating device 31 has a heating furnace 311 heating the end part to be subjected to secondary processing of a synthetic resin pipe 2. The surface temp. of the end part to be subjected to secondary processing of the synthetic resin pipe 2 before entering the heating furnace 311 is detected by a non-contact type temp. sensor. Operation is performed on the basis of the detection result by a central data processing part 314 to set the heating temp. of the heating furnace 311.
ADACHI YASUYUKI
MOROTA HIROYUKI
NAGAI MANABU
