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Patent Searching and Data


Title:
HEATING LAYER FOR FILM REMOVAL
Document Type and Number:
Japanese Patent JP2015013466
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of polymer film or applique construction, application, and removal.SOLUTION: An embodiment includes a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an "on-demand" de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured carbon-fiber reinforced plastic (CFRP) layer and a polymeric/metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally applied time-varying magnetic field) to provide applique with, e.g., protective functions such as ease of applique separation from the CFRP layer.

Inventors:
DANIEL J KOVACH
GARY E GEORGESON
ROBERT J MILLER
JEFFREY D MORGAN
RAWLINGS DIANE C
Application Number:
JP2014093179A
Publication Date:
January 22, 2015
Filing Date:
April 28, 2014
Export Citation:
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Assignee:
BOEING CO
International Classes:
B32B27/18; B64C1/00; B64D45/02; B64F5/00; C09J7/02
Domestic Patent References:
JP2008541616A2008-11-20
JP2012516269A2012-07-19
JP2001354915A2001-12-25
JP2010106193A2010-05-13
JPH07179828A1995-07-18
Foreign References:
US20120231197A12012-09-13
Attorney, Agent or Firm:
Yoshitaka Sonoda
Yoshinori Kobayashi