Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HERMETIC SEAL HOUSING AND METHOD OF MANUFACTURING HERMETIC SEAL HOUSING
Document Type and Number:
Japanese Patent JP2011029447
Kind Code:
A
Abstract:

To provide a housing which can shield RF leakage between internal semiconductor chips and reduce the weight and which allows hermetic sealing using a YAG laser welding machine having normal output.

A shielding wall 15 for shielding RF leakage between semiconductor chips is arranged in a given shape. Lids 22 and 21 with which a chip mounting portion 14 is covered are welded to connecting portions 13a and 13b and a connecting portion 15a formed on the upper surface of an opening edge 13 and the upper surface of the shielding wall 15 by a welding discharge plasma sintering method. A housing body 12, the opening edge 13, and the shielding wall 15 are formed of aluminum alloy. The connecting portions 13a, 13b, and 15a and the lids 21 and 22 are formed of iron-cobalt-nickel alloy (Kovar). The formation of the connecting portions 13a and 13b and the connecting portion 15a and the welding to the connection portion 13a and/or the connecting portion 15a of the lids 21 and 22 are performed by using a YAG laser welding machine having discharge plasma sintering method normal output.


Inventors:
OGAWA FUMISUKE
Application Number:
JP2009000174494
Publication Date:
February 10, 2011
Filing Date:
July 27, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC TOSHIBA SPACE SYS LTD
International Classes:
H01L23/02
Domestic Patent References:
JP2006014088A2006-01-12
JP2002280481A2002-09-27
JPH1174455A1999-03-16
JPH09181207A1997-07-11
JPH11345893A1999-12-14
JP2003224427A2003-08-08
Foreign References:
WO2007108262A12007-09-27
Attorney, Agent or Firm:
家入 健