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Patent Searching and Data


Title:
HIGH-FREQUENCY CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JP2001352206
Kind Code:
A
Abstract:

To obtain a small-sized high-frequency circuit which includes a distributing circuit and a composing circuit.

This high-frequency circuit device is equipped with a laminated circuit 10 constituted by inserting a 1st conductor transmitting a signal into a 1st dielectric layer 22, arranging a 1st ground conductor layer 16 and a 2nd ground conductor layer 18 having 1st openings 20 facing each other across the 1st dielectric layer 22 on the top and reverse sides of the 1st dielectric layer 22, arranging 2nd dielectric layers 24 on the top surfaces of the 1st and 2nd ground conductor layers respectively, and arranging a couple of 2nd conductors 14 transmitting signals on the top surfaces of the 2nd dielectric layers 24 respectively so that parts of them face each other across the 1st openings 20.


Inventors:
MATSUZUKA TAKAYUKI
KATO TAKAYUKI
Application Number:
JP2000000171331
Publication Date:
December 21, 2001
Filing Date:
June 07, 2000
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L25/18; H01L21/822; H01L23/52; H01L25/04; H01L27/04; H01P3/08; H01P5/02; H01P5/12; H01P5/18; H03F3/60; (IPC1-7): H01P5/12; H01L23/52; H01L25/04; H01L25/18; H01L27/04; H01L21/822; H01P3/08; H01P5/02; H03F3/60
Attorney, Agent or Firm:
Mamoru Takada (3 outside)