Title:
高周波ドラム型スリップリング・モジュール
Document Type and Number:
Japanese Patent JP5153869
Kind Code:
B2
Abstract:
A drum-style slip-ring module (100) is used in a contact-type communication system. The module utilizes PCB construction to construct a plurality of stacked electrically-conductive rings (102) and a plurality of dielectric layers (104) electrically isolating the conductive rings. Each of the dielectric layers includes a centrally-located aperture (107). The module also includes a cylindrical ground plane (108) positioned in the centrally-located aperture. The module is configured to provide electrical connection to each of the rings at an exterior surface of the module. Each group of feed line vias can be designed as impedance-controlled transmission lines with connections to each ring group. The construction described in this invention can create slip-ring transmission line structures with bandwidth from DC to 5 GHz or higher, allowing the slip-ring to be used to transfer multi-gigabit digital data streams.
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Inventors:
Coleman, Donnie, S.
Garyen, Jack, Tee.
Garyen, Jack, Tee.
Application Number:
JP2010508367A
Publication Date:
February 27, 2013
Filing Date:
May 02, 2008
Export Citation:
Assignee:
Moog Incorporated
International Classes:
H01R39/00
Domestic Patent References:
| JP39023939Y1 | ||||
| JP2006519467A | ||||
| JP55043378U |
Attorney, Agent or Firm:
Asamura patent office
Hideto Asamura
Hajime Asamura
Toru Mori
Yutaka Yoshida
Katsunori Shirae
Tadashi Tanaka
Ken Kanai
Hideto Asamura
Hajime Asamura
Toru Mori
Yutaka Yoshida
Katsunori Shirae
Tadashi Tanaka
Ken Kanai