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Patent Searching and Data


Title:
HIGH POWER CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JP2006054392
Kind Code:
A
Abstract:

To provide an inexpensive and highly reliable base substrate or package by using a high-temperature conductive material corresponding to a high output circuit device.

This high output circuit device is configured by forming a ceramic insulating layer 14 by forming a film of a dielectric material on a carbon substrate 10 constituted of the simplex of a high-temperature conductive carbon material, or the complex of the high temperature conductive carbon material 11 and a metallic material 12, and forming an electric line 16 of a conductive pattern by printing or a semiconductor lithograph technology on the insulating layer. A power IC is directly mounted on the carbon material 11 and connected through an Au wire 15 to the electric line 16. Even when the power IC 18 is directly bonded to the carbon material 11, stress causing the difference of thermal expansion coefficients between the materials is absorbed and relaxed so that it is possible to provide a base substrate or package which is excellent in thermal conductivity, and high in heat reliability.


Inventors:
YAMAMOTO HIDEFUMI
Application Number:
JP2004236632A
Publication Date:
February 23, 2006
Filing Date:
August 16, 2004
Export Citation:
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Assignee:
NEC SCHOTT COMPONENTS CORP
International Classes:
H01L23/373; H01L23/36