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Title:
HOLDING TABLE, AND GRINDING METHOD AND CUTTING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2015199153
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a holding table capable of sucking and holding even a plate-like workpiece having warp without complicating processes and deteriorating productivity, and a grinding method and a cutting method using the holding table.SOLUTION: A holding table holds a plate-like workpiece. The holding table includes: a base table having a suction surface on a front face and including a suction section connected to a suction source; and an elastic pad which is disposed on the suction surface of the base table and has a plurality of suction passages formed to communicate an abutting surface abutting on the suction surface with a holding surface for holding the plate-like workpiece on a back face of the abutting surface. In the holding table, the elastic pad has hardness that the plate-like workpiece sinks in the elastic pad by self-weight of the plate-like workpiece, and the elastic pad contracts to prescribed thickness when the elastic pad sucks the plate-like workpiece.

Inventors:
SEKIYA KAZUMA
Application Number:
JP2014078452A
Publication Date:
November 12, 2015
Filing Date:
April 07, 2014
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B41/06; B23Q3/08; B23Q3/10; B24B7/04; B24B27/06; H01L21/301; H01L21/304
Domestic Patent References:
JP2006015457A2006-01-19
JP2012121096A2012-06-28
JPH11339647A1999-12-10
JP2014011378A2014-01-20
JPH0414239A1992-01-20
JP2012187645A2012-10-04
JPH09109021A1997-04-28
Foreign References:
US5964646A1999-10-12
Attorney, Agent or Firm:
松本 昂
岡本 知広