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Patent Searching and Data


Title:
HOLLOW BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2000071325
Kind Code:
A
Abstract:

To prevent a hollow part from exposing and make the removal of sealing tapes unnecessary at the recycling of a board by a method wherein each of the end parts to the extruding direction of a synthetic resin board is bent at right angles by means of a V-groove and, at the same time, the hollow part exposed at the tip surface of the bent end part is sealed with a different panel.

A V-groove 20 is produced at the end part to the direction, in which the hollow part 14 of a hollow synthetic resin board 10 is formed, so as to bend the end parts at right angles. After that, the portion of the end part projecting beyond the top surface of the board 10 is cut off with a cutter so as to make a tip surface 24 flush with the main surface of the board 10. Next, a different hollow panel 28 is joined to the tip surface 24. Then, a hollow panel 28 is pressed against a portion, at which an opening formed by the hollow part 14 of the tip surface 24 is exposed, by means of a sealing bar 35. At this time, the sealing bar 35 is heated and, at the same time, a pressing force is applied to the hollow panel 28. As a result, the portion, which abuts against the connecting wall part of the hollow board 10, of the hollow panel 28 is crushed, resulting in sealing the hollow part 14 with the hollow panel 28.


Inventors:
TAKAHASHI SHINICHI
Application Number:
JP24870198A
Publication Date:
March 07, 2000
Filing Date:
September 02, 1998
Export Citation:
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Assignee:
TOKAN KOGYO CO LTD
International Classes:
B32B3/02; B29C53/04; B29C53/36; B29D22/00; B29L31/60; (IPC1-7): B29C53/36; B29C53/04; B29D22/00; B32B3/02
Attorney, Agent or Firm:
Osamu Matsumura