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Patent Searching and Data


Title:
HOLLOW POLYAMIDE MOLDED PRODUCT
Document Type and Number:
Japanese Patent JPH02302440
Kind Code:
A
Abstract:
PURPOSE:To provide the subject transparent molded product having a high gas-barrier property and heat resistance against boiling water and suitable as a packaging material by comprising bis-(3-methyl-4-aminocyclohexyl)methane, isophthalic acid, etc., in a specific ratio. CONSTITUTION:The objective molded product is made of a copolymer comprising (A) a diamine component consisting of (i) bis-3-methyl-4-aminocyclohexyl) methane and (ii) hexamethylenediamine in a molar ratio of 3:97 to 30:79 and (B) a dicarboxylic acid component consisting of (i) isophthalic acid and (ii) terephthalic acid in a molar ratio of 60:40 to 100:0 and having an etarel of 1.8 to 2.5 in a concentration of 1g/dl in 98% concentrated sulfuric acid at 25 deg.C.

Inventors:
URABE HIROSHI
Application Number:
JP12157989A
Publication Date:
December 14, 1990
Filing Date:
May 17, 1989
Export Citation:
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Assignee:
MITSUBISHI CHEM IND
International Classes:
B29D22/00; C08G69/26; C08J5/00; B29K77/00; (IPC1-7): B29D22/00; B29K77/00; C08G69/26; C08J5/00
Attorney, Agent or Firm:
Hidetake Komatsu (2 outside)