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Title:
HOLLOW RESIN MOLDED BOARD WITH REINFORCING SHAPE MATERIAL AND MOLDING METHOD AND DEVICE THE BOARD
Document Type and Number:
Japanese Patent JP3672616
Kind Code:
B2
Abstract:

PURPOSE: To provide a hollow resin molded board, which is uniform and highly dense, has a small strain, the strength of which is heightened by means of reinforcing shape material, the surface of which is woody and has attractive outward appearance.
CONSTITUTION: Extruding ground is extruded through an extruding die 19 equipped with a square injection port, through which a large amount of the extruding ground can be delivered, into a molding die 10. Within the molding die 10, core bodies 40, which extend from the melting zone to the slow cooling zone of the molding die 10, are provided parallel to one another and to the extrusion direction. By extruding the ground in the molding die 10 and applying inhibitory force to the ground, shrinkage void and the like are prevented from developing and uniformly, highly dense and highly accurately mold straight hollow parts with small strain so as to form a hollow resin molded board by fittingly inserting reinforcing shape material in the hollow parts. Further, the extrusion molding is carried out by employing wooden synthetic powder, which is produced by mixing 25-80wt.% of thermoplastic resin molding material with 20-75wt.% of wood flour made of cellulose-based fragments having a water content of within 15wt.% and the average particle diameter of 20 mesh or finer, gelatingly kneading, cooling, grinding and granulating.


Inventors:
Sadao Nishibori
Application Number:
JP11491995A
Publication Date:
July 20, 2005
Filing Date:
May 12, 1995
Export Citation:
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Assignee:
Ein Engineering Co., Ltd.
International Classes:
B27N3/02; B29C47/88; B29C48/30; B29C69/00; B29D7/00; B29D22/00; B29K105/16; B29K401/00; B29L7/00; B29L22/00; (IPC1-7): B29D7/00; B27N3/02; B29C47/12; B29C47/88; B29C69/00; B29D22/00
Domestic Patent References:
JP8118452A
JP8164551A
JP3224713A
JP3176117A
JP3007322A
JP3190717A
JP51017977A
JP4007283B2
Attorney, Agent or Firm:
Masaaki Ogura