Title:
ホットメルト接着剤組成物、および積層体
Document Type and Number:
Japanese Patent JP6922248
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive hot-melt adhesive composition that can bond adherends together strongly with high conductivity expressed.SOLUTION: A hot-melt adhesive composition contains a thermoplastic resin and a conductive filler. The hot-melt adhesive composition has a volume resistivity value of less than 1000 Ωcm. The thermoplastic resin has 190°C melt viscosity of 1 Pa s or more and 1000 Pa s or less.SELECTED DRAWING: Figure 1
Inventors:
Kotaro Mizuno
Tsutomu Hiroshima
Takeshi Yoshikawa
Tsutomu Hiroshima
Takeshi Yoshikawa
Application Number:
JP2017029635A
Publication Date:
August 18, 2021
Filing Date:
February 21, 2017
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
International Classes:
B32B13/06; B32B7/025; C09J7/35; C09J9/02; C09J11/04; C09J167/00; C09J177/00; C09J201/00
Domestic Patent References:
| JP3020378A | ||||
| JP2010511082A | ||||
| JP53147732A | ||||
| JP5501425A | ||||
| JP2005264134A | ||||
| JP2015136811A | ||||
| JP2019519626A | ||||
| JP5543118A | ||||
| JP2004197012A |
Foreign References:
| EP3236479A1 |