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Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JPS6142583
Kind Code:
A
Abstract:

PURPOSE: The titled adhesive having excellent low-temperature adhesiveness, washing resistance, wash-and-wear properties, drycleaning resistance, flame retardancy, etc., consisting of a specified chlorine-containing copolymer.

CONSTITUTION: 50W90mol% vinylidene chloride and/or vinyl chloride, 50W 10mol% monomer mixture of (meth)acrylonitrile and an alkyl ester of an (α- methyl-substituted) ethylenically unsaturated aliphatic acid (e.g. methyl methacrylate) in a molar ratio of 0.1W10, and 0W10mol% functional monomer copolymerizable with these (e.g. acrylic acid) are made to undergo emulsion polymerization at 20W80°C in an aqueous medium of a pH of 1W6 in the presence of a radial polymerization initiator to give a hot-melt adhesive comprising a chlorine- containing copolymer which contains terminal functional molecule components consisting of a decomposition product of the polymerization initiator, and has a melting or softening point of 50W150°C and a melt viscosity in this range of melting or softening point of 1×106W1×103P.


Inventors:
NOMURA TADANORI
Application Number:
JP16343684A
Publication Date:
March 01, 1986
Filing Date:
August 02, 1984
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C08F214/06; C08F214/08; C08F220/12; C08F220/44; C09J127/04; (IPC1-7): C08F214/06; C08F214/08; C08F220/12; C08F220/44; C09J3/14
Attorney, Agent or Firm:
Toru Hoshino