Title:
電子・電気機器部品屑の処理方法
Document Type and Number:
Japanese Patent JP7029333
Kind Code:
B2
Abstract:
To provide a processing method of an electronic-electrical equipment component scrap capable of selecting the electronic-electrical equipment component scrap properly and efficiently.SOLUTION: A processing method of an electronic-electrical equipment component scrap includes a process for selecting a substrate scrap in the electronic-electrical equipment component scrap by using a hue sorter 1 including at least two camera units 3a, 3b capable of discriminating each hue on frond and rear both surfaces of a processing object.SELECTED DRAWING: Figure 1
Inventors:
Katsushi Aoki
Takeda Tsubasa
Takeda Tsubasa
Application Number:
JP2018065562A
Publication Date:
March 03, 2022
Filing Date:
March 29, 2018
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C22B1/00; B09B5/00; G01J3/51
Domestic Patent References:
| JP2007029923A | ||||
| JP2003156447A | ||||
| JP2015078913A | ||||
| JP2000343044A | ||||
| JP2003236474A | ||||
| JP2013000685A | ||||
| JP2002210417A |
Foreign References:
| US20110017644 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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