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Title:
複数の光学部品をウェーハ段階で集積化する方法
Document Type and Number:
Japanese Patent JP4310410
Kind Code:
B2
Abstract:
A method of making optical elements on a wafer level comprising: - making a master including an array of optical elements; - embossing a replica of said array of optical elements by applying said master to an embossable material; and - dicing said replica to form individual optical elements.

Inventors:
Brian Harden
Alan Cassman
Michael Feldman
Application Number:
JP2000515296A
Publication Date:
August 12, 2009
Filing Date:
October 02, 1998
Export Citation:
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Assignee:
TESSERA NORTH AMERICA, INC.
International Classes:
H01L25/16; G02B6/42; G03F9/00; G11B7/12; G11B7/135; G11B7/22; H01L23/02; H01L27/00; H01L27/146; H01L31/12; H01S5/022; G02B6/12; H01S3/00; H01S5/00
Domestic Patent References:
JP6318625A
JP5291388A
JP62108545A
JP60060739A
JP4070752U
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka



 
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