Title:
HYBRID IC AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0917943
Kind Code:
A
Abstract:
PURPOSE: To improve the reliability of the electrical connection between an insulating substrate and a lead frame when a hybrid IC is transfer-molded.
CONSTITUTION: This hybrid IC 8 is formed by forming a plurality of through hole conductive areas, electrically connected to an electronic component 3 through a wiring pattern, on the periphery of an insulating substrate 7, bonding and securing the through hole conductive areas and a lead frame 5 together using a conductive adhesive material 9.
Inventors:
IMAI MAKOTO
Application Number:
JP18797895A
Publication Date:
January 17, 1997
Filing Date:
June 30, 1995
Export Citation:
Assignee:
JAPAN ENGINE VALVE MFG
International Classes:
H01L23/50; H01L23/52; H01L25/065; H01L25/07; H01L25/18; (IPC1-7): H01L23/52; H01L23/50
Next Patent: SEMICONDUCTOR INTEGRATED CIRCUIT FOR SYNTHESIZER