PURPOSE: To provide a positive resist material for high energy beam exposure having high sensitivity and resolution and excellent in process adaptivity.
CONSTITUTION: In the high energy beam sensitive positive resist containing a resin (A) made by substituting t-butoxycarbonyloxy group for one part of hydroxide group of polyhydroxy styrene, a dissolution inhibitor (B) and an acid generating agent and capable of developing by an alkali aq. solution, (B) contains above one of t-butoxycarbonyloxy group in one molecule, (C) is made by mixing above two kind of the acid generating agent expressed by a formula (chem.1), (R)nAM (in the formula, R is the same or different and is aromatic group or substituted aromatic group, A is sulfonium or iodonium. M is tosylate group or triflate group and (n) is 2 or 3), and the weight ratio is 0.07≤B≤0.40, 0.005≤C≤0.15, 0.55≤A and A+B+C=1.
KAWAI YOSHIO
MATSUDA KOREHITO
| JPH04158363A | 1992-06-01 | |||
| JPH04195138A | 1992-07-15 | |||
| JPH0262544A | 1990-03-02 | |||
| JPH0331845A | 1991-02-12 | |||
| JPH05232705A | 1993-09-10 | |||
| JPH05134414A | 1993-05-28 |