To provide an illumination device that performs suitable light emission control over a plurality of LEDs while lowering the mounting cost, and dissipates heat of a light emitting element even when the light emitting element emits with high luminance.
An illumination device 1 comprises: a mounting substrate 2; a plurality of light emitting elements 3 mounted on the mounting substrate 2; a sealing frame 4 provided on the mounting substrate 2 and surrounding the plurality of light emitting elements 3; a sealing material 5 charged in the sealing frame 4 and sealing the light emitting elements 3 in contact with the light emitting elements 3; a heat diffusion portion 7 included in the mounting substrate 2 and diffusing the heat of the light emitting elements 3 from the mounting region of the plurality of light emitting elements 3 to a peripheral region; a heat transport portion 8 transporting the heat from the heat diffusion portion 7 in a predetermined direction; and a heat dissipation portion 9 emitting the heat transported by the heat transport portion 8 to the outside. The sealing material 5 is transparent or translucent, an upper surface thereof is in at least one of a concave shape and a convex shape, and the sealing material 5 performs at least one of diffusion and condensation of the light emitted by the light emitting elements 3.
MIZUTA KEI
UEDA SUSUMU
FUKUNAGA NORIYASU
KOWADENKI CO LTD
UNIV KAGOSHIMA
| JP2007194519A | 2007-08-02 | |||
| JP2005340065A | 2005-12-08 | |||
| JP2005311170A | 2005-11-04 |
| WO2009000105A1 | 2008-12-31 |
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