Title:
衝撃解体装置
Document Type and Number:
Japanese Patent JP7186443
Kind Code:
B2
Abstract:
To realize high-speed separation of an electronic substrate, a battery and a casing without imparting excessive crush or excessive impact to an electronic apparatus to be crushed.SOLUTION: An impact dismantling device includes a storage mechanism 1 storing a loaded electronic apparatus and having a discharge port 1a for discharging it to a first conveyor 2, a positioning mechanism 4 for positioning the electronic apparatus on the first conveyor 2 so as to assume a predetermined attitude, and a cutting mechanism 5 for cutting the electronic apparatus being carried in a positioned state into a predetermined width along both long sides of the electronic apparatus. After having its ends of the long sides cut by the cutting mechanism 5, the electronic apparatus is pushed out onto a second conveyor 7 and both of its short sides are cut into a predetermined width by a second positioning mechanism 8 and a second cutting mechanism 9, after which the inside of the electronic apparatus is simultaneously impacted by the impact device 10.SELECTED DRAWING: Figure 3
Inventors:
Takao Ueda
Shigeki Furuya
Tatsuya Oki
Shigeki Furuya
Tatsuya Oki
Application Number:
JP2019111233A
Publication Date:
December 09, 2022
Filing Date:
June 14, 2019
Export Citation:
Assignee:
National Institute of Advanced Industrial Science and Technology
International Classes:
B09B3/35
Domestic Patent References:
| JP2017164707A | ||||
| JP2006267801A | ||||
| JP2001337305A |