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Title:
IN-SITU DETECTION OF BORDER OF METAL THIN FILM STATE USING OPTICAL INTERFERENCE THROUGH DYNAMIC UPDATE REFERENCE
Document Type and Number:
Japanese Patent JP2005101114
Kind Code:
A
Abstract:

To find a terminal point during chemical mechanical polishing (CMP) treatment.

A reflection spectrum data sample is received corresponding to a plurality of spectra of a light reflected from the irradiation part of a wafer surface. The reflection spectrum data sample is normalized by using normalization reference comprising a first reflection spectrum data sample obtained before the CMP treatment stage. Further, the normalization reference is updated during treatment by using second reflection spectrum data sample obtained in a stage before the CMP treatment. The second reflection spectrum data sample is obtained after the first reflection spectrum data sample. The terminal point is decided based on optical interference which happens to reflection spectrum data.


Inventors:
SUNDER AMAACHUA
Application Number:
JP2003000330684
Publication Date:
April 14, 2005
Filing Date:
September 22, 2003
Export Citation:
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Assignee:
LAM RES CORP
International Classes:
B24B49/12; B24B37/013; H01L21/304; (IPC1-7): H01L21/304; B24B37/04; B24B49/12
Attorney, Agent or Firm:
特許業務法人明成国際特許事務所