SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Title:

SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH0661355

Kind Code:

A

Abstract:

PURPOSE: To reduce the connection resistance of an upper layer wiring with a lower later wiring in a multilayer wiring of a semiconductor device.

CONSTITUTION: In the connection of an upper layer wiring having a laminated structure consisting of a second conductive film 3 which consists of a titanium tungsten used as an adhesive metal, and a fourth conductive film 8, which exists on the film 3 and consists of gold which is used as a main wiring material, with a lower layer wiring, a high-resistivity titanium tungsten film does not exist on the connection part between an upper layer gold wiring and a lower layer gold wiring and a gold film of the upper layer wiring and a gold film of the lower layer wiring are directly connected to each other.

Inventors:

URABE KOJI

Application Number:

JP20867492A

Publication Date:

March 04, 1994

Filing Date:

August 05, 1992

Export Citation:

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Assignee:

NEC CORP

International Classes:

H01L21/28; H01L21/3205; H01L21/768; H01L23/52; (IPC1-7): H01L21/90; H01L21/28; H01L21/3205

Attorney, Agent or Firm:

Naoki Kyomoto (2 outside)

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