Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INJECTION MOLDING DIE
Document Type and Number:
Japanese Patent JPH09234771
Kind Code:
A
Abstract:

To provide an injection molding die capable of restraining cool- solidification of molten resin flown in the tip end of a pressurized fluid injection device, and thus avoiding the tip end of the pressurized fluid injection device from being clogged even in setting the temperature of the die low for shortening the injection molding cycle.

The die is employed for introducing pressurized fluid from a pressurized fluid injection device 20 installed in the mold into molten thermoplastic resin injected within a cavity 16 provided in the cavity, thereby forming a hollow part in the inside of thermoplastic resin within the cavity 16, and it includes a die member 20 at the adjacent part between it and the tip end 32 of the pressurized fluid injection device 30, and the die member 20 is manufactured of material having a low coefficient of heat conduction.


Inventors:
KIBOSHI SHINJI
KANEISHI AKIMASA
Application Number:
JP6734396A
Publication Date:
September 09, 1997
Filing Date:
February 28, 1996
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL CO
MITSUBISHI ENG PLAST KK
International Classes:
B29C45/26; B29C45/00; B29C45/17; B29K101/12; B29L22/00; (IPC1-7): B29C45/26; B29C45/00
Attorney, Agent or Firm:
Takahisa Yamamoto