Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INSERT COMPONENT AND RESIN MOLDED ARTICLE USING THE SAME
Document Type and Number:
Japanese Patent JP2012025086
Kind Code:
A
Abstract:

To provide an insert component which can prevent damage to an electronic component in resin molding, and to provide a resin molded article using the same.

The insert component 11 includes: at least the electronic component 12 having a sensor element 17, a terminal 14 connected to the sensor element 17, and a package resin part 13 formed by integrally molding the sensor element 17 and an end part of the terminal 14 with resin; a circuit board 15 connected to the electronic component 12 by the terminal 14; and a base 16 on which the circuit board 15 is arranged. The base 16 includes at least a wall part 16a to be brought into contact with a surface 13b which is opposite to a surface 13a where the terminal 14 protrudes from the package resin part 13.


Inventors:
HATTORI TAKASHI
IKEDA YUKIO
Application Number:
JP2010000167657
Publication Date:
February 09, 2012
Filing Date:
July 27, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CABLE
International Classes:
B29C45/14; B29C33/12; B29C45/02; H05K5/00; B29K105/20; B29L31/34
Attorney, Agent or Firm:
沖川 寛