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Patent Searching and Data


Title:
INSPECTING METHOD OF MAGNETIC BUBBLE ELEMENT
Document Type and Number:
Japanese Patent JPS5753884
Kind Code:
A
Abstract:

PURPOSE: To realize the measurement of various characteristics such as a magnetic resistance, a coercive force in every process on a wafer, by measuring the characteristic of the measuring part for film characteristic consisting of a permalloy film formed on the wafer in every working stage.

CONSTITUTION: A part 8 where a chip of a magnetic bubble element is formed at the center of a wafer 6 is coated on the wafer by means of, for instance, a sputtering process to be worked into a strip-shaped pattern. The change of magnetic resistance of that part is measured at this stage of process. Then an SiO2 film 4 is coated on the pattern by a sputtering process, and a through-hole 10 is provided to expose the surface of the part 8 for measuring. The change of magnetic resistance is measured again at this stage of process. In the same way, the subsequent stages of process are carried out successively, and the change of the magnetic resistance of the part 8 for measuring is measured in every process. Based on the results of these measurements, the working conditions for an actual production of magnetic bubble elements are obtained.


Inventors:
KODAMA NAOKI
IKEDA HITOSHI
SUZUKI MAKOTO
TSUMITA NORIKAZU
Application Number:
JP12798880A
Publication Date:
March 31, 1982
Filing Date:
September 17, 1980
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G11C11/14; G11C19/08; (IPC1-7): G11C11/14