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Patent Searching and Data


Title:
INSPECTION METHOD, MANUFACTURING METHOD AND INSPECTION DEVICE FOR THIN FILM DEVICE
Document Type and Number:
Japanese Patent JP2005319557
Kind Code:
A
Abstract:

To provide a technology for simplifying condition setting for inspecting an unpolished part in inspecting a thin film device.

Focusing not on envelopes 63 of spectral reflectance data but on vibration center components 91 of the spectral reflectance data, when the unpolished part is thick, detection of the unpolished part and computing/condition setting of the film thickness of the unpolished part are carried out utilizing that the vibration center components 91 of the spectral reflectance data on the surface of a sample gradually approach the surface reflectance 81 of a material itself still with the unpolished part eventually. The film thickness of the unpolished part can be evaluated without evaluating the relation between the appearance amount of data outside of a region surrounded by the envelopes 63, and the film thickness of the unpolished part beforehand.


Inventors:
HIROSE TAKESHI
NOMOTO MINEO
Application Number:
JP2004141087A
Publication Date:
November 17, 2005
Filing Date:
May 11, 2004
Export Citation:
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Assignee:
RENESAS TECH CORP
International Classes:
G01B11/06; B24B37/013; H01L21/304; H01L21/66; (IPC1-7): B24B37/04; G01B11/06; H01L21/304; H01L21/66
Attorney, Agent or Firm:
Yamato Tsutsui