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Title:
ISOCYANATE-CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS54117597
Kind Code:
A
Abstract:

PURPOSE: To prepare an epoxy resin composition having improved low-temperature curability, acid resistance and water resistance, and giving the coatings having improved adherence and wet-on-wet coating processability, by adding a hydroxyl group-containing aromatic resin and an isocyanate hardener to a hydroxyl group- containing epoxy resin.

CONSTITUTION: A new epoxy resin composition comprising (A) a hydroxyl group- containing aromatic resin having a hydroxyl value of 25 - 150 (e.g. copolymer of styrene with phenol), (B) a polyol comprsing an epoxy resin having two or more hydroxyl groups, or its derivative and (C) an isocyanate hardener (e.g. 2,4-tolylene diisocyanate). The preferable compounding ratio of (A) - (C) is 60 - 5 wt.%, 40 - 95 wt.% and 0.3 - 1.5 equivalent of isocyanate group (on the bais of 1 equivalent of hydroxyl group), respectively.

EFFECT: The excellent characteristics of epoxy resins, particularly of chemical resistance and oil resistance, are not lowered.


Inventors:
WADA AKIRA
Application Number:
JP2423378A
Publication Date:
September 12, 1979
Filing Date:
March 03, 1978
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
C08G18/00; C08G18/40; C08G18/58; C08G18/67; (IPC1-7): C08G18/58; C08G18/67



 
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