Title:
JOINTING SYSTEM FOR BUILDING PANEL
Document Type and Number:
Japanese Patent JP3515494
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily and surely joint thin floor panels and eliminate a step of a jointed part due to plate thickness tolerance by fitting both the floor panel through a metal strip applied on one floor panel with unevenness.
SOLUTION: The floor panels 1, 2 of thickness of 3 mm are laid on a floor face 12. At first, a notch 20 and a tolerance equalization face 40 are formed on the floor panel 1 in a factory to adhere a strip part 6 comprising an aluminum sheet, a tolerance equalization face 42, a lock groove 14 and a lock tongue 30 are formed on the floor panel 2, and the thickness E of the joined part of the floor panels 1, 2 is adjusted to a prescribed value. In a jobsite, the floor panel 1 is laid on the floor face 12, the tongue part 30 of the floor panel 2 is fitted to the notch 20 of the floor panel 12, and the lock groove 14 is fitted to the lock element 8 of the strip part 6 to be jointed. Thereby the thin floor panels 1, 2 are easily and surely jointed, and the plate thickness tolerance of the floor panels 1, 2 is eliminated to make the jointed part flat.
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Inventors:
Pervan, Tony
Application Number:
JP2000208190A
Publication Date:
April 05, 2004
Filing Date:
April 29, 1994
Export Citation:
Assignee:
VAELINGE ALUMINUM AB
International Classes:
E04D3/362; E04B1/38; E04B1/68; E04B5/00; E04C2/00; E04C2/30; E04F13/08; E04F15/00; E04F15/02; E04F15/04; E04F15/14; E04F15/18; E04F; (IPC1-7): E04F15/02; E04F15/00
Attorney, Agent or Firm:
佐藤 一雄 （外２名）
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