Title:
Lamination ceramic electronic parts and its mounting board
Document Type and Number:
Japanese Patent JP6223924
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component in which the denseness of external electrodes is enhanced, and to provide a mounting board thereof.SOLUTION: A multilayer ceramic electronic component includes a ceramic body 110 including a dielectric layer 111, first and second internal electrodes 121, 122, and first and second external electrodes 131, 132 coupled electrically to the first and second internal electrodes 121, 122. The first and second external electrodes 131, 132 includes first and second base electrodes 131a-131c, 132a-132c, and first and second terminal electrodes 131d, 132d arranged on the first and second base electrodes. The first and second base electrodes include first electrode layers 131a, 132a containing first glass, and second electrode layers 131c, 132c formed on the first and second electrode layers, and containing second glass. On the interface of the first electrode layers 131a, 132a and the second electrode layers 131c, 132c, secondary phases 131b, 132b are arranged by reaction of the first glass and second glass.
More Like This:
| JP6095040 | Lamination ceramic electronic parts |
| JP3257531 | LAMINATED ELECTRONIC COMPONENT |
Inventors:
Lee Chang Choi
Kang Hee Sun
Khan Bum Suk
Kim Hyu Young
Kang Hee Sun
Khan Bum Suk
Kim Hyu Young
Application Number:
JP2014153612A
Publication Date:
November 01, 2017
Filing Date:
July 29, 2014
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01G4/232; H01C7/18; H01F17/03; H01G4/30
Domestic Patent References:
| JP2006332284A | ||||
| JP2012244150A | ||||
| JP2014027248A | ||||
| JP2001250740A |
Foreign References:
| US20140029157 |
Attorney, Agent or Firm:
Konobu Kato
Fukukawa Shinya
Fukukawa Shinya