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Title:
LAMINATION MOLDING APPARATUS AND LAMINATION MOLDING METHOD
Document Type and Number:
Japanese Patent JP2017154411
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To collect powder materials other than a modeled product and to reuse the powder materials at a low cost in the case of molding the modeled product by lamination using plural powder materials.SOLUTION: A lamination molding apparatus of the present invention includes: a supply section that includes plural materials including powders of which the respective particle size distributions are separated, that makes the materials into a mixed material having a predetermined mixture ratio, and that supplies the mixed material; a molding section that laminates the mixed material and that molds a three-dimensional modeled product from the laminated material; and a collection section that collects the remaining mixed material of the laminated material other than the three-dimensional modeled product and that includes a separation section that separates the collected mixed material into the respective materials on the basis of the particle size distributions.SELECTED DRAWING: Figure 1

Inventors:
OUCHI AKIRA
HISHIKI MINA
YANAGIDA YUKI
Application Number:
JP2016040624A
Publication Date:
September 07, 2017
Filing Date:
March 03, 2016
Export Citation:
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Assignee:
NEC CORP
International Classes:
B29C67/00; B22F3/105; B22F3/16; B28B1/30; B33Y10/00; B33Y30/00
Domestic Patent References:
JP2005088392A2005-04-07
JP2000336403A2000-12-05
JP2002205339A2002-07-23
JP2005335199A2005-12-08
Foreign References:
WO2015141776A12015-09-24
US5304329A1994-04-19
Attorney, Agent or Firm:
Desk
Naoki Shimosaka