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Patent Searching and Data


Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPS62202546
Kind Code:
A
Abstract:

PURPOSE: To prevent the squeeze-out of a plating metal by providing a means of preventing the squeeze-out of the partially plated metal outside of a mold resin on the side of part covered with the mold resin of an inner lead.

CONSTITUTION: A V-shaped groove 3 is provided on the side 1a of an inner lead 1. The V-shape grove 3 prevents the external squeeze-out of a plating liquid when partial plating is carried out even if the upper and the lower surfaces of the inner lead 1 are held by a mask and a plating metal 2 is not adhered to the outside from the V-shape groove. Accordingly, the plating metal 2 is not squeezed out toward the outside of a mold resin.


Inventors:
AMARI YOSHIO
Application Number:
JP4436786A
Publication Date:
September 07, 1987
Filing Date:
February 28, 1986
Export Citation:
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Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H01L23/50; H01L23/28; H01L23/495; (IPC1-7): H01L23/28; H01L23/48
Domestic Patent References:
JPS62169457A1987-07-25
JPS56169338A1981-12-26
Attorney, Agent or Firm:
Takao Watanuki