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Title:
LEAD TERMINAL STRUCTURE IN PLATE-SHAPED RESISTANCE
Document Type and Number:
Japanese Patent JPH0278201
Kind Code:
A
Abstract:

PURPOSE: To eliminate a nonuniformity of a current distribution between an electrode conductor part and a resistance and to enhance a mechanical strength at a bonded part by a method wherein a core wire of a lead wire is bonded to the electrode conductor part after the core wire has been wound on a metal piece.

CONSTITUTION: A core-wire bundle 5 of a lead wire 4 which has been wound on a metal piece 6 is bonded to a plate-shaped electrode conductor part 3. As a result, a nonuniformity of a current distribution between the conductor part 3 and a plate-shaped thin-film resistance 2 can be eliminated without making the conductor part 3 large, and a mechanical strength at a bonded part can be enhanced.


Inventors:
MIZOGUCHI MASASHI
NISHITANI KAZUNORI
Application Number:
JP22845988A
Publication Date:
March 19, 1990
Filing Date:
September 14, 1988
Export Citation:
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Assignee:
HIGH FREQUENCY HEATTREAT
NITSUKOOMU KK
International Classes:
H01C1/14; (IPC1-7): H01C1/14
Attorney, Agent or Firm:
Shigenobu Oshiro (2 outside)



 
Next Patent: JPH0278202