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Title:
LEVELING METHOD FOR PRINTED BOARD TO BE SOLDERED, AND SOLDER LIQUID SUBMERGING MECHANISM OF SOLDERING DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2013157489
Kind Code:
A
Abstract:

To provide a novel leveling method for a printed board and a solder liquid submerging mechanism of a soldering device using the same.

A leveling method includes steps of holding a substrate while specifying a reference surface which is parallel to a lower surface of the substrate by coordinating with a work table which is submerged in a solder liquid surface, measuring vertical distance from three points on the reference surface, not on the same straight line, to respective solder liquid surfaces, and further, based on a measurement value, adjusting the reference surface to be parallel to the solder liquid surface, for leveling of the substrate. A solder liquid submerging mechanism 1 includes a work table 2 which is supported by a frame 41 above a solder bath 5 and is raised/lowered parallelly to the solder liquid surface, with a substrate holding means being fitted, a measuring means 3 provided, by coordination with the work table, at three positions not on the same straight line of a reference surface 31 specified to be parallel to the substrate held by the work table, and a level adjusting means 4 which supports the work table for tilting further and raising/lowering, with the frame as a support stage.


Inventors:
KUWAJIMA MARE
DOTO HIDEO
Application Number:
JP2012000017495
Publication Date:
August 15, 2013
Filing Date:
January 31, 2012
Export Citation:
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Assignee:
SHINKA TECHNOLOGY CO LTD FA
International Classes:
H05K3/34; B23K1/00; B23K1/08; B23K101/42
Attorney, Agent or Firm:
水野 博文