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Title:
LIGHT EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011114341
Kind Code:
A
Abstract:

To provide a light emitting element package and a method of manufacturing the same.

The light emitting diode package includes: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.


Inventors:
PARK YOUNG SAM
HAHM HUN JOO
Application Number:
JP2010252964A
Publication Date:
June 09, 2011
Filing Date:
November 11, 2010
Export Citation:
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Assignee:
SAMSUNG LED CO LTD
International Classes:
H01L33/48; H01L23/28
Domestic Patent References:
JP2004039778A2004-02-05
JP2008166462A2008-07-17
JP2008226928A2008-09-25
Foreign References:
WO2009093498A12009-07-30
KR20090047306A2009-05-12
Attorney, Agent or Firm:
Longhua International Patent Service Corporation