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Title:
LIGHT EMITTING ELEMENT PACKAGE
Document Type and Number:
Japanese Patent JP2011114342
Kind Code:
A
Abstract:

To provide a light emitting element package capable of improving a heat radiation characteristic of generated thermal energy.

The light emitting element includes a package body, a light emitting element mounted in a cavity of the package body, an enclosing layer for enclosing the light emitting element, and electrodes connected to the light emitting element, wherein the package body is formed of a substance having relatively-small thermal conductivity relative to a substance constituting the enclosing layer.


Inventors:
SEO TAE WON
Application Number:
JP2010256650A
Publication Date:
June 09, 2011
Filing Date:
November 17, 2010
Export Citation:
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Assignee:
LG INNOTEK CO LTD
International Classes:
H01L33/48; H01L33/50; H01L33/56; H01L33/58; H01L33/64
Domestic Patent References:
JP2009071090A2009-04-02
JP2008270709A2008-11-06
Attorney, Agent or Firm:
Toshihiro Kindaka