Title:
LIGHT EMITTING ELEMENT PACKAGE
Document Type and Number:
Japanese Patent JP2011114342
Kind Code:
A
Abstract:
To provide a light emitting element package capable of improving a heat radiation characteristic of generated thermal energy.
The light emitting element includes a package body, a light emitting element mounted in a cavity of the package body, an enclosing layer for enclosing the light emitting element, and electrodes connected to the light emitting element, wherein the package body is formed of a substance having relatively-small thermal conductivity relative to a substance constituting the enclosing layer.
Inventors:
SEO TAE WON
Application Number:
JP2010256650A
Publication Date:
June 09, 2011
Filing Date:
November 17, 2010
Export Citation:
Assignee:
LG INNOTEK CO LTD
International Classes:
H01L33/48; H01L33/50; H01L33/56; H01L33/58; H01L33/64
Domestic Patent References:
JP2009071090A | 2009-04-02 | |||
JP2008270709A | 2008-11-06 |
Attorney, Agent or Firm:
Toshihiro Kindaka