Title:
LIQUID SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2003292572
Kind Code:
A
Abstract:
To provide a liquid sealing resin composition having low stress, excellent in adhesive strength and to provide a semiconductor device.
The liquid sealing resin composition comprises a silicone modified liquid epoxy resin, a liquid polyphenol, an imidazole derivative in microcapsule and an inorganic filler, and the silicone modified liquid epoxy resin is obtained by heating and reacting (a) an epoxy resin and (b) bisphenols in molar ratio (a/b)=1 to 10. The semiconductor device is obtained by sealing a semiconductor element with the liquid sealing resin composition.
Inventors:
AKITAYA MASAMITSU
Application Number:
JP2002105698A
Publication Date:
October 15, 2003
Filing Date:
April 08, 2002
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/30; C08G59/56; C08G59/62; H01L23/29; H01L23/31; (IPC1-7): C08G59/30; C08G59/56; C08G59/62; H01L23/29; H01L23/31