Title:
MACHINING METHOD USING WIRE SAW MACHINE
Document Type and Number:
Japanese Patent JP2002018694
Kind Code:
A
Abstract:
To perform suitable machining to a workpiece such as a magnetic core block with high dimensional accuracy, dispensing with an external setup process.
With the feed operation of a wire 7 stopped, the wire 7 is positioned to a cutting position of the magnetic core block 100, and the wire 7 is brought into contact with the cutting position of the magnetic core block 100. With the wire 7 in contact with the cutting position of the magnetic core block 100, the feed operation of the wire 7 is performed for a designated time to thereby forming a wire holding groove 10 in the cutting position of the magnetic core block 100. With the wire 7 held in the wire holding groove 10, actual cutting is started.
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Inventors:
SUGAWARA AKIRA
Application Number:
JP2000200361A
Publication Date:
January 22, 2002
Filing Date:
June 30, 2000
Export Citation:
Assignee:
SONY CORP
International Classes:
B24B27/06; (IPC1-7): B24B27/06
Attorney, Agent or Firm:
Akira Koike (2 outside)