Title:
MAGNETRON TYPE SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JPS5976875
Kind Code:
A
Abstract:
PURPOSE: To prevent bumping and sputtering accompanying therewith by forming the end part of a target on the side near a shielding ring to a flat part, and constituting the same so as to have no acute angle parts.
CONSTITUTION: A magnetron type sputtering device is provided with an anode 28, a target 30 as a cathode disposed to face to the same, and a magnet 32 and a shielding ring 36 disposed in the position near the target 30. The end part of the target 30 near the ring 36 is formed flat to avoid the presence of acute angle parts. Therefore, even if the end part of the target 30 is roughened by sputtering, the concentration of a magnetic field in the end part of the target 30 is prevented and sparking is prevented as well.
Inventors:
KIYOTA HIDEJI
HORIUCHI MITSUAKI
HORIUCHI MITSUAKI
Application Number:
JP18457782A
Publication Date:
May 02, 1984
Filing Date:
October 22, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C23C14/35; H01J37/34; H01L21/285; H01L21/3205; C23C14/36; (IPC1-7): C23C15/00; H01L21/285; H01L21/88
Domestic Patent References:
| JPS5416385A | 1979-02-06 |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)
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