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Patent Searching and Data


Title:
MANUFACTURE OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH07106362
Kind Code:
A
Abstract:

PURPOSE: To make it possible to easily realize a highly reliable aluminium bonding by a method wherein before a soldering process for soldering an element, electrodes for bonding on a thick film conductor are covered with a covering member and after the soldering process, the covering member is removed before a bonding process.

CONSTITUTION: A process for soldering an element 4, which is mounted on a circuit board 2, is provided and a process for aluminium-bonding external terminals of the board 2 to a thick film conductor 1 on the board 2 is provided to manufacture the circuit board 2. In this case, before the soldering process for soldering the element 4, a covercing process for covering electrodes for bonding on the conductor 1 with a covering member 7 is provided and after the soldering process, a removal process for removing the member 7 is provided before a bonding process. The member 7, for example, is formed of a resin, which is dissolved in a cleaning liquid for a solder paste material or a flux material. When dirt of a flux or the like is cleaned with the cleaning liquid after the element 4 is soldered, the covered resin 7 is also dissolved simultaneously in the cleaning liquid and the electrode parts for bonding are cleansed.


Inventors:
KAMIMURA RIKIYA
NAGAYAMA YOSHITAKA
Application Number:
JP1993000277496
Publication Date:
April 21, 1995
Filing Date:
October 07, 1993
Export Citation:
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Assignee:
NIPPON DENSO CO
International Classes:
H01L21/60; H01L21/603; H05K1/09; H05K3/34; (IPC1-7): H01L21/60; H01L21/603
Attorney, Agent or Firm:
藤谷 修