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Patent Searching and Data


Title:
MANUFACTURE OF COMPONENT IN HOLLOW STRUCTURE AND ITS PRODUCT
Document Type and Number:
Japanese Patent JPH02160513
Kind Code:
A
Abstract:

PURPOSE: To form a hollow part of any shape within a molding easily by a method whereby said hollow part is preliminarily formed by using an alloy melting at a relatively low temperature, fitted in a die, formed of a thermosetting resin before said alloy is melted by heat.

CONSTITUTION: For example, a hollow part 3 of a valve component for liquid use is formed of an alloy melting at a low temperature through casting or die casting. If it is further desired that a metallic component or the like is incorporated into the valve component permanently through insert molding, this component 4 is mounted in the molding of the alloy or die. The adjusted metallic component is fixed at a given position in a plastic die. Then, for example, an epoxy resin blended with a thermosetting agent is injected into the die in a manner not to generate air bubbles. After the resin is set, the resultant molding is taken out, and heated in a heating furnace. Since the epoxy resin is resistive to the temperature 80 to 160°C, the metallic component in which the hollow part is formed is formed of an alloy melting in this temperature range.


Inventors:
YOTSUTSUJI AKIRA
TSUJI HIROSHI
Application Number:
JP28200888A
Publication Date:
June 20, 1990
Filing Date:
November 08, 1988
Export Citation:
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Assignee:
KOKI ENG KK
TSUJI HIROSHI
International Classes:
B29C39/12; B29C33/52; B29C39/26; B29C43/20; B29C43/36; B29C45/16; B29C45/26; B29K63/00; B29K67/00; B29K105/06; B29L22/00; (IPC1-7): B29C33/52; B29C39/12; B29C39/26; B29C43/20; B29C43/36; B29C45/16; B29C45/26; B29K63/00; B29K67/00; B29K105/06; B29L22/00