To attain minimizing a diameter and making narrow pitch of through- holes obtained by drill machining on a connection board on which an insulating substrate having plated through-holes, electrically conductive patterns are formed.

Film making for an insulating layer 12 on a first surface 11a of an anisotropic electrically conductive substrate 11 having electrical conductivity in the plate thickness direction is performed, and a hole pattern 12a is formed on the insulating layer 12. Film making for an electrically conductive layer 13 is performed under the condition of the surface of the insulating layer 12, and the inner wall of the hole pattern 12a which is covered and a connection board 1 is obtained by forming an electrically conductive pattern 13a which is connected with the anisotropic electrically conductive substrate 11 on the bottom surface of the hole pattern 12 by patterning an electrically conductive layer 13. A semiconductor chip 15 is mounted on the first surface 11a of the anisotropic electrically conductive substrate 11 and an electrode pad 15a of the semiconductor chip 15 and the electrically conductive pattern 13a are connected by a wire 17.