PURPOSE: To manufacture a container for an electronic component having superior accuracy in size by molding a complex of containers in which a plurality of containers in cross section each having a hollow are connected to each other, cutting said complex at the connecting portions to be a plurality of containers each having independent hollow.

CONSTITUTION: Synthetic resin is supplied in an extrusion molding machine 11 wherein the synthetic resin is melted and stirred. A complex 1 of containers is thus extruded and molded out of an outlet 9 of an extruding die 6. The molded complex 1 is, after passing through a vacuum sizing device 13, cooled by a cooling medium within a cooling tank 14. The complex 1 is successively shaped and solidified, and transferred to a gravure printing apparatus 16 by a belt conveyor of a take-up device 15 so as to be printed with a predetermined symbol or number, then to a separating/cutting device 17. When the complex 1 moves, a cutter 22 also rotates, so that a receptacle 2 and the connecting portion 5 are separated. The elongated container 2 after being separated is further cut into a predetermined length by a sizing cutter 18. The manufactured container 2 is stored in a stacker 19.