MANUFACTURE OF DETECTOR ASSEMBLY LIGHTED FROM BACK

Title:

MANUFACTURE OF DETECTOR ASSEMBLY LIGHTED FROM BACK

Document Type and Number:

Japanese Patent JPS6184062

Kind Code:

A

Abstract:

A process for fabricating high performance backside illuminated detectors (10) is described. The process uses a transmissive adhesive (12) such as epoxy on a transmissive substrate (10) to hold the detector material (14) during the fabrication process. After fabrication and connection to a readout device (20), such as a CCD, the substrate (10) and adhesive (12) are removed using an appropriate solvent, leaving the thin detector assembly (14, 16), without extraneous material, mounted directly on the CCD (20). The process may be used for a variety of detector materials.

Inventors:

JIYON DABURIYU MAKINII
MAASHIYA EI HAATOREI
BURUUSU SHII KOOCHIRAN

Application Number:

JP17954685A

Publication Date:

April 28, 1986

Filing Date:

August 16, 1985

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HONEYWELL INC

International Classes:

H01L27/14; H01L21/58; H01L27/148; H01L31/18; H04N1/028; (IPC1-7): H01L27/14; H04N1/028

Attorney, Agent or Firm:

Masaki Yamakawa

Previous Patent: A laminated type semiconductor device and electronic equipment

Next Patent: PREPARATION OF METHYLATED TERTIARY AMINE THROUGH REACTION BETWEEN HEXAMETHYLENETETRAMINE AND AMINE O...