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Patent Searching and Data


Title:
MANUFACTURE OF GAS SENSOR CHIP AND MOLD
Document Type and Number:
Japanese Patent JP3694382
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method for manufacturing a gas sensor chip for efficiently manufacturing the chips of small size and complicated shape in mass production.
SOLUTION: A mold 2 having a molding opening 1 is formed of expandable and contractible polymer material. Metal oxide semiconductor powder solely or metal oxide semiconductor material 3 obtained by mixing the powder with one or more types of components selected from a group consisting of aggregate, binder, plastic material and solvent is charged in the opening 1, and molded. Thereafter, the mold 2 is elongated and the opening 1 is extended, and the molded material 3 is removed from the opening 1.


Inventors:
Hiroshi Koda
Kazuyasu Iida
Application Number:
JP4789197A
Publication Date:
September 14, 2005
Filing Date:
March 03, 1997
Export Citation:
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Assignee:
FIS Inc.
International Classes:
G01N27/12; B28B7/34; B28B13/06; (IPC1-7): G01N27/12; B28B7/34; B28B13/06
Domestic Patent References:
JP56059656U
JP60191652A
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori