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Title:
MANUFACTURE OF HOLLOW RESIN MOLDED PRODUCT, AND GAS-INJECTING-HOLE-SEALING DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2984566
Kind Code:
B2
Abstract:

PURPOSE: To easily seal a gas injecting-hole of a hollow molded product by high productivity without requiring excess parts by a method wherein a hollow resin molded product to which a flare part is arranged, is formed by a gas injecting injection molding method, and the flare part is caulked under heating to seal the gas-injecting hole.
CONSTITUTION: In a hollow resin molded product molded by a gas-injecting injection molding, a gas injecting hole 2 remains as a gas injecting pin trace, and an annular piece 3 as a flare part for preventing leakage of injecting gas is disposed in upright around the injecting hole 2. Then, a caulking jig is lowered with an actuator to be registered to the annular piece 3. When the caulking jig is further lowered to abut against a stopper, only the caulking jig is, in a sliding manner, lowered in a caulking guide. A caulked forme 12 is formed by smashing the annular piece 3 by heating to seal the gas injecting hole. The hollow resin molded product wherein the gas injecting hole 2 is thus sealed, is inserted into metal piece cavity, and covering resin is injected to form a skin layer.


Inventors:
SUGYAMA KOJI
SUWAMA TAKAHIRO
Application Number:
JP835195A
Publication Date:
November 29, 1999
Filing Date:
January 23, 1995
Export Citation:
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Assignee:
NIPPON PURASUTO KK
International Classes:
B29C45/00; B29C45/14; B29C45/17; B29C57/10; B29C67/00; B29L22/00; (IPC1-7): B29C45/00; B29C45/14
Domestic Patent References:
JP7100851A
JP1202412A
Attorney, Agent or Firm:
Hidetake Komatsu (3 outside)



 
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