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Patent Searching and Data


Title:
MANUFACTURE OF IC CARD
Document Type and Number:
Japanese Patent JPH02252593
Kind Code:
A
Abstract:

PURPOSE: To eliminate a protrusion and a recessed part on the surface of a card to prevent occurrence of damage and thereby obtain a card with satisfac tory appearance by thermally pressing the surface of a card in two steps.

CONSTITUTION: Both surfaces of a center core 1 are printed as specified, and a thin, transparent oversheet 2 is laminated on both front and rear of the core to prepare a material for the card. Then two ferro plate 3 with a matt surface are used to finish the card material with a matted surface, and are thermally pressed in one piece. A hole 4 for storing an IC module is drilled at a specified position on the card material. An adhesive is supplied to the bottom of the hole 4 using a dispenser, then the IC module 6 is placed in the hole 4 and pressed to prepare a roughly finished IC card. Next the roughly finished IC card is thermally pressed with two ferro plates 7 with a front mirror surface to finish the card surface with a mirror surface as a finally completed IC card.


Inventors:
SASAGUCHI KIYOSHI
SAITO TOSHIHARU
Application Number:
JP1989000076043
Publication Date:
October 11, 1990
Filing Date:
March 28, 1989
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B42D15/10; G06K19/077; H01L21/56; (IPC1-7): B42D15/10; G06K19/077; H01L21/56