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Patent Searching and Data


Title:
MANUFACTURE OF LEAD FRAME
Document Type and Number:
Japanese Patent JPH0730054
Kind Code:
A
Abstract:

PURPOSE: To prevent insulator from being left on the resin feed side of a lead by a method wherein photosensitive resin fed onto a lead frame is made to start being exposed to light from its side opposite to its other feed side, and an insulator is formed to link leads together.

CONSTITUTION: Insulating, photosensitive resin 20 cured by ultraviolet ray or the like is fed over a lead frame 10. The photosensitive resin 20 fed onto the lead frame 10 is made to start being exposed to light to be cured from its side opposite to its other feed side, whereby an insulator formed of photosensitive resin 20 is formed. Uncured photosensitive resin 20 is removed by cleaning. As mentioned above, the photosensitive resin 20 is made to start being exposed to light to be cured from its side opposite to its other feed side, so that the feed side of resin 20 fed onto the lead frame 10 is not exposed to light, only resin filled in between leads due to its own weight is cured by light exposure to link the leads together. Therefore, insulator is hardly left on the resin feed side of leads.


Inventors:
OKANO TATSUHIRO
MIZUNO ATSUSHI
Application Number:
JP1993000175460
Publication Date:
January 31, 1995
Filing Date:
July 15, 1993
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H01L21/56; H01L23/28; H01L23/29; H01L23/31; H01L23/50; (IPC1-7): H01L23/50; H01L21/56; H01L23/28; H01L23/29; H01L23/31