To suppress warping of the bottom of the cavity of a multilayered ceramic substrate having the cavity at the time of manufacturing the substrate by thermocompression bonding a plurality of green sheets to each other.

At the time of thermocompression bonding a plurality of green sheets 21 constituting the lower-layer section of a multilayered ceramic substrate to each other, an constraint film 25 is put on the lower surface of the lowermost green sheet 21 with its adhesive-applied surface upward, and the film 25 and sheet 21 are put between parallel plates 26 and 27 and thermocompression bonded to each other. Consequently, the constraint film 25 is simultaneously thermocompression bonded to the lower surface of the lowermost green sheet 21 at the time of thermocompression bonding the green sheets 21 of the lower-layer section to each other. Then a plurality of green sheets 22 constituting the upper-layer section of the substrate having a hole section 24 for a cavity 23 is put on the green sheets 21 of the lower-layer section and the green sheets 22 and 21 are put between the parallel plates 26 and 27 and thermocompression bonded to each other. When the upper- and lower layer sections are thermocompression bonded to each other, the arresting film 25 works to prevent the warping of the bottom of the cavity 23 by suppressing the elongation of the green sheets 21 in the facial direction. The constraint film 25 is stripped off before a baking process.